فلكس لحام NC-559-ASM TPF بوزن 100 جرام، من نوع No-Clean، مصمم لتحسين انسيابية اللحام وتقليل الأكسدة أثناء العمل. يتميز بلزوجة... Read more
15,000 IQD Excl. VAT
فلكس لحام NC-559-ASM TPF بوزن 100 جرام، من نوع No-Clean، مصمم لتحسين انسيابية اللحام وتقليل الأكسدة أثناء العمل. يتميز بلزوجة عالية، وبقايا قليلة بعد اللحام، ويعد خيارًا مثاليًا لإعادة لحام وإصلاح مكونات BGA وSMD وPCB.
المواصفات:
الاستخدامات:
The NC-559-ASM TPF is a high-performance 100g no-clean solder flux paste designed to improve solder wetting and reduce oxidation during soldering. It leaves minimal residue and is ideal for BGA reballing, SMD rework, PCB assembly, and electronic repairs.
Specifications:
Applications:
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We ship worldwide. Your order will be packaged really carefully and delivered wherever you want. Delivery takes between 2-4 business days. You will receive an e-mail after ordering with more information about the delivery.
Orders can be returned or exchanged within 30 days of receiving the parcel, providing they are in original resalable condition.
We work hard to deliver your items without damage. Orders can be returned or exchanged within 30 days of receiving the parcel, providing they are in original resalable condition.
