Description

NC-559-ASM TPF solder flux, 100g, No-Clean type, designed to improve solder wetting and reduce oxidation during operation. It features high viscosity, low residue after soldering, and is an ideal choice for reballing and repairing BGA, SMD, and PCB components.

Specifications:

• Type: No-Clean Solder Flux Paste
• Model: NC-559-ASM TPF
• Weight: 100g
• High viscosity
• Low residue after soldering
• Compatible with leaded and lead-free solder
• Suitable for BGA, SMD & PCB rework

Applications:

• BGA soldering
• SMD soldering
• PCB repair
• Phone maintenance
• Laptop maintenance
• Reballing electronic chips

The NC-559-ASM TPF is a high-performance 100g no-clean solder flux paste designed to improve solder wetting and reduce oxidation during soldering. It leaves minimal residue and is ideal for BGA reballing, SMD rework, PCB assembly, and electronic repairs.

Specifications:

• Type: No-Clean Solder Flux Paste
• Model: NC-559-ASM TPF
• Weight: 100g
• High viscosity
• Low residue
• Compatible with leaded and lead-free solder
• Suitable for BGA, SMD & PCB rework

Applications:

• BGA reballing
• SMD rework
• PCB assembly
• Smartphone repair
• Laptop repair
• Electronic maintenance

المواصفات

• الوزن: داخلي وخارجي

Pros and cons

• منتج مستدام، مثالي للاستخدام اليومي
• قد يتغير لونه عند التعرض لأشعة الشمس المباشرة